Global LTCC Market Forecast and Analysis 2016-2021

Semiconductor and Electronics

LTCC 2017 report studies in Global Market, especially in Europe, North America, South America, Asia (Excluding China), China and ROW, with definitions, classifications, applications and industry chain structure, development trends, competitive landscape analysis, and key regions development and import/export status to 2021.



The Low Temperature Co-fired Ceramic (LTCC) technology can be defined as a way to produce multilayer circuits with the help of single tapes. These single sheets have to be laminated together and fired all in one step. This saves time, money and reduces circuits’ dimensions. Another great advantage is that every single layer can be inspected before firing which prevents the need of manufacturing a whole new circuit. Because of the low firing temperature (about 850°C), it is possible to use the low resistive materials such as silver and gold instead of molybdenum and tungsten.

LTCC production, which measures output worldwide, was expected to reach 14,233 million units in 2016 with an increase of 11.21% from its year-earlier level. The global LTCC market size is estimated to grow from USD 486.57 million in 2011 to USD 915.67 million by 2016, at an estimated CAGR of 13.5% between 2011 and 2016. With regards to this, key players of LTCC industry are expected to find potential opportunities in this market.

The global LTCC market report profiles some of the key technological developments in the recent times. It also profiles some of the leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. The major players in the global LTCC market are Murata, Kyocera, TDK, Bosch, Taiyo Yuden, Hitachi Metals, C-MAC MicroTechnology, ATC, Soshin, ACX, etc.

Table of Contents

“Preface
Part 1. Scope of Report
1.1 Methodology
1.2 Geographic Scope
1.3 Years Considered
Part 2. Introduction
2.1 Definition
2.2 Benefits of LTCC
2.3 LTCC RF Components
2.4 Current Scenario
Part.3 Value Chain Analysis
3.1 Upstream
3.1.1 Ceramic Powder & Green Tape
3.1.2 Passive Components
3.2 Downstream
Part 4. Manufacture
4.1 Manufacturing Process
4.2 Manufacturing Costs
Part 5. Company Profiles
5.1 Murata (Japan)
5.1.1 Business Overview
5.1.2 Products Offered
5.1.3 Business Performance
5.2 Kyocera (Japan)
5.2.1 Business Overview
5.2.2 Products Offered
5.2.3 Business Performance
5.3 TDK (Japan)
5.3.1 Business Overview
5.3.2 Products Offered
5.3.3 Business Performance
5.4 Taiyo Yuden (Japan)
5.4.1 Business Overview
5.4.2 Products Offered
5.4.3 Business Performance
5.5 Soshin (Japan)
5.5.1 Business Overview
5.5.2 Products Offered
5.5.3 Business Performance
5.6 Hitachi Metals (Japan)
5.6.1 Business Overview
5.6.2 Products Offered
5.6.3 Business Performance
5.7 BOSCH (Germany)
5.7.1 Business Overview
5.7.2 Products Offered
5.7.3 Business Performance
5.8 C-MAC MicroTechnology (Belgium)
5.8.1 Business Overview
5.8.2 Products Offered
5.8.3 Business Performance
5.9 ATC (USA)
5.9.1 Business Overview
5.9.2 Products Offered
5.9.3 Business Performance
5.10 ACX (Taiwan)
5.10.1 Business Overview
5.10.2 Products Offered
5.10.3 Business Performance
5.11 Mag.Layers (Taiwan)
5.11.1 Business Overview
5.11.2 Products Offered
5.11.3 Business Performance
5.12 Microgate (China)
5.12.1 Business Overview
5.12.2 Products Offered
5.12.3 Business Performance
5.13 BDStar Navigation (China)
5.13.1 Business Overview
5.13.2 Products Offered
5.13.3 Business Performance
5.14 Sunlord (China)
5.14.1 Business Overview
5.14.2 Business Performance
5.15 Ray Tech (China)
5.15.1 Business Overview
5.15.2 Products Offered
5.15.3 Business Performance
Part 6. Market Overview
6.1 Global Production Volume 2011-2016
6.2 Production Volume by Region 2011-2016
6.2.1 China
6.2.2 North America
6.2.3 EMEA
6.2.4 Asia-Pacific
6.3 Global Production Value 2011-2016
6.4 Production Value by Region
6.4.1 China
6.4.2 North America
6.4.3 EMEA
6.4.4 Asia-Pacific
Part 7. Consumption Pattern
7.1 Regional Consumption
7.1.1 China
7.1.2 North America
7.1.3 EMEA
7.1.4 Asia-Pacific
7.2 Global Consumption by Application
7.3 Chinese Consumption by Application
Part 8. Market Forecast
8.1 Market Size Forecast
8.1.1 Market Size by Volume (Million Units)
8.1.2 Market Size by Value (M USD)
8.2 Regional Consumption Forecast
8.2.1 China
8.2.2 North America
8.2.3 EMEA
8.2.4 Asia-Pacific
8.3 Consumption Forecast by Application
Part 9. Market Dynamics
9.1 Market Drivers
9.1.1 Telecommunications & Automotive
9.1.2 Time to Market & Cost Efficient
9.1.3 Increase in R&D Investments
9.1.4 Demand in Developing Countries
9.2 Market Constraints
9.2.1 Entry Barriers
9.2.2 Rising Labor Costs
9.2.3 Exchange Rate
9.2 Market Strategies
9.3 Key Events
Part 10. Investment Feasibility
10.1 Global Economic Highlight 2015
10.2 Recent Developments
10.3 The Updated Forecast
10.3.1 Advanced Economies
10.3.2 Emerging Market and Developing Economies
10.4 China Outlook 2016
10.5 Investment in China
10.5.1 Outlook on investment
10.5.2 Growth opportunities
10.5.3 Policy Trends
10.5.4 Conclusions
10.6 Feasibility of New Project
10.6.1 Basis and Presumptions
10.6.2 New Project in China


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